COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips XVII is to be held in Yokohama on April 14-16, 2014, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All papers will be published online via IEEE Xplore. Authors of best papers will be recommended to submit an extended version to a COOL Chips special issue of IEEE Micro.
Contributions are solicited in the following areas:
- Low Power-High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
- Novel Architectures and Schemes for Single Core, Multi/Many-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.
- Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Techniques.
Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare the extended abstract using the given guidelines and template below.
In the extended abstract, the status of the product or topic should precisely be described. If this is a not-yet-announced product, and you would like to keep the submission confidential, please indicate it. We will do our best to maintain confidentiality.
Proposals will be selected by the program committee’s evaluation of interest to the audience. Submission should be made by e-mail, to M. Ikeda, Program Chair : submit_xvii”at”coolchips.org. (Please replace the “at” to @.)
February 4, 2014 Extended Abstract Submission (by e-mail)
February 12, 2014 Extended Abstract Submission (by e-mail)
- March 12, 2014 Acceptance Notified (by e-mail)
- March 28, 2014 Final Manuscript Submission
|Call for Posters|
You are also invited to submit proposals for poster sessions by e-mail, to K. Hashimoto, Poster Chair: poster_xvii”at”coolchips.org. (Please replace the “at” to @.)
Extended abstract submissions should be ONE page, formatted using standard two-column IEEE format. They are refereed primarily based on their relevance to the conference. Accepted abstracts will be published in the Proceedings of the COOL Chips XVII. All participants in this track will have an opportunity to present a poster and a short talk. Submission of a paper to the track signifies an agreement to have one author present the work at the conference. “Best Poster Award” is presented. The award will be given for Best Poster voted by participants. However, the poster presenter should attend during the poster session and closing session, or will lose the chance.
Author Schedule (Poster):
March 17, 2014 Poster Abstract Submission (by e-mail)
March 22, 2014 Poster Abstract Submission (by e-mail)
- March 25, 2014 Poster Acceptance Notified (by e-mail)
Best Poster Award
Speaker of the best poster of COOL Chips, IEEE Symposium on Low-Power and High-Speed Chips, will be awarded as the “Best Poster Award of COOL Chips.”
Chaired by COOL Chips Poster Chair
PC Chairs, Vice Chair and Poster Chair
(Makoto Ikeda, Fumio Arakawa, Jun Yao and Koji Hashimoto)
Award winner is selected among the posters selected as the poster presentations at COOL Chips and presented at the conference site. Award winner is selected based on voting of the attendees, and the Award Committee will finalize the Award winner (only one person).
Award winner is announced at the closing of COOL Chips Symposium. Award winner will receive the award prize of 30,000 JP Yen. Award winner should remain until the Awarding ceremony to receive the Award, otherwise Award will be canceled.
Sponsored by the Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society. In cooperation with the IEICE Electronics Society and IPSJ.