IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 22)
COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 22 is to be held in Yokohama on April 17-19, 2019.
February 8, 2019February 22, 2019 Extended Abstract Submission
- March 15, 2019 Acceptance Notified
- March 29, 2019 Final Manuscript Submission
March 22March 26, 2019 Poster Abstract Submission March 25March 29, 2019 Poster Acceptance Notified
For any questions, please contact the Secretariat of COOL Chips 22:
cool_22 “_at_” coolchips.org (Please replace the “at” to @.)