COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 22 is to be held in Yokohama on April 17-19, 2019.
- Aug 20, 2018: Web site opened.
- February 8, 2019 Extended Abstract Submission
- March 15, 2019 Acceptance Notified
- March 29, 2019 Final Manuscript Submission
- March 22, 2019 Poster Abstract Submission
- March 25, 2019 Poster Acceptance Notified
For any questions, please contact the Secretariat of COOL Chips 22:
cool_22 “_at_” coolchips.org (Please replace the “at” to @.)