IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XI
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 16 - 18, 2008

Call for Conttribution
Call for Participation
Advanced Program
Registration
Travel Information
Organizing Committee
Program Committee
Advisory Committee

Sister Conferences
HOT CHIPS 16 HOT INTERCONNECTS 12

Advisory Committee:
Chair M. J. Flynn (Stanford Univ., USA)
Vice Chair: T. L.Kunii (Kanazawa Inst. of Tech, Japan)
Members D. Allison (Stanford Univ.,USA)
D. B. Alpert (Camelback Computer Architecture, USA)
A. J. Baum (Intel, USA)
M. A. Franklin (Washington Univ., USA)
G. Goto (Yamagata Univ., Japan)
S. Hijiya (Fujitsu Labs., Japan)
S. Iwade (Osaka Inst. of Tech., Japan)
G. Lee (Univ. Illinois - Chicago, USA)
J. Iwamura (Toshiba, Japan)
L. Jow (Hewlett-Packard (TCMCOMP Chair), USA)
R. Kasai (NTT Electronics, Japan)
S. Kohyama (Covalent Materials Corp, Japan)
T. Makimoto (TechnoVision Consulting, Japan)
O. Mencer (Imperial College, UK)
H. Miyabe (NTT, Japan)
H. Mochida (Rohm, Japan)
A. Morino (SIRIJ, Japan)
K. Nagasawa (Renesas Tech., Japan)
M. Nakamura (Hitachi, Japan)
T. Nukii (Sharp, Japan)
H. Sasaki (NEC, Japan)
K. Sasaki (Hitachi ULSI, Japan)
K. Shimohigashi (STARC, Japan)
T. Tabata (Sanyo Electric, Japan)
S. Takahashi (Oki Electric Ind., Japan)
T. Watanabe (RIKEN, Japan)
N. Woo (Samsung, Korea)
S. Yamaguchi (Matsushita Electric Ind., Japan)