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Chair
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M. J. Flynn (Stanford Univ., USA)
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Vice Chair:
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T. L.Kunii (Kanazawa Inst. of Tech, Japan)
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Members
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D. Allison (Stanford Univ.,USA)
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D. B. Alpert (Camelback Computer Architecture, USA)
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A. J. Baum (Intel, USA)
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M. A. Franklin (Washington Univ., USA)
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G. Goto (Yamagata Univ., Japan)
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S. Hijiya (Fujitsu Labs., Japan)
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S. Iwade (Osaka Inst. of Tech., Japan)
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G. Lee (Univ. Illinois - Chicago, USA)
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J. Iwamura (Toshiba, Japan)
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L. Jow (Hewlett-Packard (TCMCOMP Chair), USA)
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R. Kasai (NTT Electronics, Japan)
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S. Kohyama (Covalent Materials
Corp, Japan)
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T. Makimoto (TechnoVision
Consulting, Japan)
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O. Mencer (Imperial College, UK)
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H. Miyabe (NTT, Japan)
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H. Mochida (Rohm, Japan)
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A. Morino (SIRIJ, Japan)
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K. Nagasawa (Renesas Tech., Japan)
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M. Nakamura (Hitachi, Japan)
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T. Nukii (Sharp, Japan)
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H. Sasaki (NEC, Japan)
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K. Sasaki (Hitachi ULSI, Japan)
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K. Shimohigashi (STARC, Japan)
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T. Tabata (Sanyo Electric, Japan)
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S. Takahashi (Oki Electric Ind., Japan)
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T. Watanabe (RIKEN, Japan)
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N. Woo (Samsung, Korea)
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S. Yamaguchi (Matsushita Electric Ind., Japan)
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