IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XI
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 16 - 18, 2008

Call for Conttribution
Call for Participation
Advanced Program
Registration
Travel Information
Organizing Committee
Program Committee
Advisory Committee

Sister Conferences
HOT CHIPS 16 HOT INTERCONNECTS 12

Organizing Committee:
Chair T. Nakamura (Keio Univ., Japan)
Vice Chairs Y. Hagiwara, (Sony, Japan)
  H. Kobayashi, (Tohoku Univ.,Japan)
  A. Omondi (Seoul National Univ., Korea)
  J. Torrellas, (University of Illinois, Urbana-Champaign, USA)
Secretary K. Suzuki (NEC, Japan)
Treasurers T. Ogura (Ritsumeikan Univ., Japan)
  J. Naganuma (NTT, Japan)
Program Co-chairs K. Uchiyama (Hitachi, Japan)
M. Ikeda (Univ. of Tokyo, Japan)
Publicity Chairs M. Suzuki (Panasonic, Japan)
M. Nishihara (IBM, Japan)
Publication Chairs H. Kubosawa (Fujitsu Labs, Japan)
Y. Unekawa (Toshiba, Japan)
Registration Chair S. Furuno (Oki Ekectric Ind., Japan)
Local Arrangement Chair Y. Nitta (Renesas Tech, Japan)
Web & Presentation Manager R. Egawa (Tohoku Univ., Japan)