IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XI
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 16 - 18, 2008

Call for Conttribution
Call for Participation
Advanced Program
Registration
Travel Information
Organizing Committee
Program Committee
Advisory Committee

Sister Conferences
HOT CHIPS 16 HOT INTERCONNECTS 12

Program Committee:
Co-Chairs K. Uchiyama (Hitachi, Japan),
M. Ikeda (Univ.of Tokyo, Japan)
Vice Chairs K. Kimura (Waseda Univ., Japan)
F. Arakawa (Hitachi, Japan)
Poster Chair T. Sato (Kyusyu Univ., Japan)
Special Session Chair K. Inoue (Kyusyu Univ., Japan)
Member S. Y.Borkar (Intel, USA)
K. Hirairi (Sony, Japan)
T. Kodaka (Toshiba, Japan)
G. Lee (Univ. Illinois - Chicago, USA)
H. Nakamura (Univ. of Tokyo, Japan)
H. Shimada (Kyoto Univ.)
O. Takahashi (IBM, USA)
T. -H. Tsai (NCU, Taiwan)
H. Yamauchi (SAMSUNG, Korea)
K. -R. Cho (Chungbuk National Univ.)
H. Igura (NEC, Japan)
Y. Kodama (AIST, Japan)
T. Miyazaki (Univ. of Aizu, Japan)
Y. Sato (JAIST, Japan)
M. H. Sunwoo (Ajou Univ.)
H. Takizawa (Tohoku Univ., Japan)
T. Tsutsumi (Meiji Univ., Japan)
K. S. Yeo (NTU, Singapore)
M. Harada (Tohoku Univ., Japan)
H. Kawaguchi (Kobe Univ., Japan)
M. Kuga (Kumamoto Univ., Japan)
M. Muroyama (Kyushu Univ., Japan)
Y. Shibata (Nagasaki Univ., Japan)
H. Suzuki (Renesas Tech., Japan)
N. Togawa (Waseda Univ., Japan)
U. Walterscheidt (Intel, USA)
T. Yoshitake (Fujitsu Labs., Japan)
T. Hashimoto (Panasonic, Japan)