General Information

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 23)

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 23 is to be held in Tokyo on April 15-17, 2020.



Important Dates

  • February 7, 2020 Extended Abstract Submission
  • March 13, 2020 Acceptance Notified
  • March 27, 2020 Final Manuscript Submission
  • March 20, 2020 Poster Abstract Submission
  • March 23, 2020 Poster Acceptance Notified


For any questions, please contact the Secretariat of COOL Chips 23:
cool_23 “_at_” (Please replace the “at” to @.)