General Information

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 25)


IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 25 is to be held on April 20-22, 2022 in Tokyo, Japan.

Given the on-going Covid-19 pandemic, there is currently uncertainty in the format of the Conference. However, the safety of our speakers and attendees will remain of paramount concern. Thus, we will be fully prepared to deliver a virtual conference.




Important Dates

  • February 11, 2022   Paper / Extended Abstract Submission (Web site)
  • March 18, 2022  Acceptance Notified (by e mail)
  • April 1, 2022  Final Manuscript Submission
  • March 25, 2022  Poster Abstract Submission (Web site)
  • March 28, 2022  Poster Acceptance Notified (by e mail)

For any questions, please contact the Secretariat of COOL Chips 25:
cool_25 “_at_” (Please replace the “at” to @.)