IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 26)
IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 26 is to be held on April 19-21, 2023 in Tokyo.
Announcements
Important Dates
- February 10, 2023 Paper / Extended Abstract Submission (Web site)
- March 17, 2023 Acceptance Notified (by e mail)
- March 31, 2023 Final Manuscript Submission
- March 24, 2023 Poster Abstract Submission (Web site)
- March 27, 2023
Poster Acceptance Notified (by e mail)
For any questions, please contact the Secretariat of COOL Chips 26:
cool_26 “_at_” coolchips.org (Please replace the “at” to @.)
