IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 26)
IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 26 is to be held on April 19-21, 2023 in Tokyo.
COOLChips 26 was successfully held during April 19-21, 2023.
Award Winners @ COOLChips 26
Best Poster Award
- “Optimized Deep MLP for Tensor Train-based Inference Engine” by Jiale Yan, Masato Motomura
- February 28
February 10, 2023 Paper / Extended Abstract Submission (Web site)
- March 17, 2023 Acceptance Notified (by e mail)
- March 31, 2023 Final Manuscript Submission
- March 31
March 24, 2023 Poster Abstract Submission (Web site)
- April 3
March 27, 2023 Poster Acceptance Notified (by e mail)
For any questions, please contact the Secretariat of COOL Chips 26:
cool_26 “_at_” coolchips.org (Please replace the “at” to @.)