General Information

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 27)

IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 27 is to be held on April 17-19, 2024 in Tokyo.

COOLChips 27 was successfully held during April 17-19, 2024.

Award Winners @ COOLChips 27

Best Poster Award

    • “Approximate Random Weight Generator & CiM Integration for Neuromorphic Computing”, by Naoko Misawa, Shunsuke Koshino, Ruhui Liu, Chihiro Matsui, and Ken Takeuchi




Important Dates

  • February 27, 2024   Paper / Extended Abstract Submission (Web site)
  • March 15, 2024  Acceptance Notified (by e mail)
  • March 29, 2024  Final Manuscript Submission
  • March 22 March 29, 2024  Poster Abstract Submission (Web site)
  • March 25 April 1, 2024  Poster Acceptance Notified (by e mail)

For any questions, please contact the Secretariat of COOL Chips 27:
cool_27 “_at_” (Please replace the “at” to @.)