General Information

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 28)

IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 28 is to be held on April 16-18, 2025 in Tokyo.

COOLChips 28 was successfully held during April 16-18, 2025.

Award Winners @ COOLChips 28

Best Poster Award

    • “A Machine Learning-Based Power Prediction Framework for DCIM Circuits”, by Chih-Li Hsiao, Hsiu-Wei Chen, Shih-Hsu Huang and Jin-Fu Li (Department of Electronic Engineering, Chung Yuan Christian University, Taiwan)

Featured Poster Award

    • “An Acceleration of Homomorphic Encryption for GPUs focusing on Polynomial graph”, by Ai Nozaki, Takuya Kojima, Hiroshi Nakamura, and Hideki Takase (The University of Tokyo, Tokyo, Japan)

    • “A Data Compression Method for DL-SCAs using Denoising Autoencoders”, by Masaki Morita, Takuya Kojima, Haruto Ishii, Hideki Takase and Hiroshi Nakamura (The University of Tokyo, Japan)

    • “Pattern-Aware Encoding Scheme for Parameter Compression of Binary Neural Networks”, by Babak Golbabaei, Yirong Kan, Renyuan Zhang, Yasuhiko Nakashima (Nara Institute of Science and Technology, Japan)

Announcements

 

Important Dates

  • February 7 February 17, 2025 (JST)   Paper / Extended Abstract Submission (Web site)
  • March 14, 2025  Acceptance Notified (by e mail)
  • March 28, 2025  Final Manuscript Submission
  • March 21, 2025  Poster Abstract Submission (Web site)
  • March 24, 2025  Poster Acceptance Notified (by e mail)

For any questions, please contact the Secretariat of COOL Chips 28:
cool_28 “_at_” coolchips.org (Please replace the “at” to @.)