COOL Chips XV
Yokohama Joho Bunka Center (Yokohama Media & Communications Center),
Yokohama, Japan
Call for Contribution
Call for Participation
Advance Program
Registration
Organizing Committee
Program Committee
Advisory Committee
Travel Information
Past COOLCHIPS

Sister Conferences HOT CHIPS HOT INTERCONNECTS



The 15th anniversary of IEEE annual symposium COOL15

Program Committee:

Chairs
M. Ikeda (Univ.of Tokyo)
F. Arakawa (Renesas)
Vice Chair
H. Shimada (NAIST)
Poster Chair
K. Hashimoto (Fukuoka Univ.)
Special Session Chair
H. Tomiyama (Ritsumeikan Univ.)
Members
A. Ben-Abdallah (Aizu Univ.)
K. -R. Cho (Chungbuk National Univ.)
A. Gupta (Freescale)
T. Harada (Yamagata Univ.)
T. Hashimoto (Panasonic)
Y. Inoguchi (JAIST)
H. Kawaguchi (Kobe Univ.)
K. Kimura (Waseda Univ.)
T. Kobori (NEC)
T. Kodaka (Toshiba)
Y. Kodama (Univ of Tsukuba)
M. Kuga (Kumamoto Univ.)
G. Lee (Korea Univ.)
S. -J. Lee (TI)
K. Morioka (Fujitsu Labs.)
M. Muroyama (Tohoku Univ.)
B. -G. Nam (Chungnam National Univ.)
S. Otani (Renesas)
Y. Shibata (Nagasaki Univ.)
H. Takizawa (Tohoku Univ.)
N. Togawa (Waseda Univ.)
T. -H. Tsai (NCU Taiwan)
T. Tsutsumi (Meiji Univ.)
T. Yamada (Hitachi)
H. Yamauchi (Samsung)
J. Yao (NAIST)
K. S. Yeo (NTU Singapore)
(in alphabetical order)
As of January 31, 2012