General Information

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 20 is to be held in Yokohama on April 19-21, 2017.

COOLChips 20 was successfully held during April 19-21, 2017.

Award Winners @ COOLChips 20

     Best Poster Award

    “A Flip-Flop with High Soft-error Tolerance and Small Power and Delay Overheads” by Kodai Yamada, Haruki Maruoka, Jun Furuta, and Kazutoshi Kobayashi

     Featured Poster Award

    “CNN Acceleration on Multi-FPGA System” by Kazusa Musha and Hideharu Amano


What’s new
From this year’s symposium, the COOL Chips Program Committee will ask the IEEE Transactions on Multi-Scale Computing Systems (TMSCS) to publish selected papers in a special issue on COOL Chips 20. Authors of industrial best papers will be recommended to submit an extended version to a COOL Chips special issue of IEEE Micro.




Important Dates

  • February 13, 2017 Extended Abstract Submission
  • March 8, 2017 Acceptance Notified
  • March 31, 2017 Final Manuscript Submission
  • March 24, 2017 Poster Abstract Submission
  • March 29, 2017 Poster Acceptance Notified



For any questions, please contact the Secretariat of COOL Chips 20:
       cool_20 “_at_” (Please replace the “at” to @.)