Call for Contributions

[pdf version is here] (As of November 24, 2016)

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 20 is to be held in Yokohama on April 19-21, 2017, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All papers will be published online via IEEE Xplore. From this year’s symposium, the COOL Chips Program Committee will ask the IEEE Transactions on Multi-Scale Computing Systems (TMSCS) to publish selected papers in a special issue on COOL Chips 20. Authors of industrial best papers will be recommended to submit an extended version to a COOL Chips special issue of IEEE Micro.

Contributions are solicited in the following areas:

  • Low Power-High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
  • Novel Architectures and Schemes for Single Core, Multi/Many-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.
  • Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Techniques.

Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare the extended abstract using the given guidelines and template below.

Author’s kit:

Submit Format:   pdf, doc

In the extended abstract, the status of the product or topic should precisely be described. If this is a not-yet-announced product, and you would like to keep the submission confidential, please indicate it. We will do our best to maintain confidentiality.

Proposals will be selected by the program committee’s evaluation of interest to the audience. Submission should be made through submission site.

Submission site:

Author Schedule:

  • February 13, 2017    Extended Abstract Submission (through website)
    February 6, 2017    Extended Abstract Submission (through website)
  • March 8, 2017          Acceptance Notified (by e-mail)
  • March 31, 2017          Final Manuscript Submission


Call for Posters

You are invited to submit proposals for a poster session either by e-mail to K. Hashimoto, Poster Chair, or through poster submission site (during open test). Please check that the website is for “COOL Chips 20 Poster Session“, if you select to submit through the website.

Submission site:

E-mail address:     poster_20 “at” (Please replace the “at” to @.)

Extended abstract submissions should be ONE page, formatted using standard two-column IEEE format. In addition, one page may be added optionally for figures or tables only. Please be careful not to put the main text of your abstract into the additional second page.

They are refereed primarily based on their relevance to the conference. We also welcome proposals presenting works in progress or reporting preliminary results, in any of the conference themes. Accepted abstracts will be published in the Proceedings of the COOL Chips 20.

All poster presenters will be given the opportunity to present their work in short talks.
At least one of the authors must be registered at the conference.

Author Schedule (Poster):

  • March 15, 2017       Poster Abstract Submission (by e-mail)
  • March 24, 2017    Extended Poster Abstract Submission (by e-mail or through website)
  • March 22, 2017       Poster Acceptance Notified (by e-mail)
  • March 29, 2017    Poster Acceptance Notified (by e-mail)


Best Poster Award

Speaker of the best poster of COOL Chips, IEEE Symposium on Low-Power and High-Speed Chips, will be awarded as the “Best Poster Award of COOL Chips.”

Award Committee:
Chaired by COOL Chips Poster Chair
PC Chairs, Vice Chair and Poster Chair
(Makoto Ikeda, Fumio Arakawa, Yasutaka Wada and Koji Hashimoto)

Award Selection:
Award winner is selected among the posters selected as the poster presentations at COOL Chips and presented at the conference site.
Award winner is selected based on voting of the attendees, and the Award Committee will finalize the Award winner.

Award winner is announced at the closing of COOL Chips Symposium. The Best Award winner will receive the award prize of 30,000 JP Yen. Award winner should remain until the Awarding ceremony to receive the Award, otherwise Award will be canceled.


COOLCHips Sponsor Logo

Sponsored by the Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society.  In cooperation with the IEICE Electronics Society and IPSJ.