General Information

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 25)


IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 25 is to be held on April 20-22, 2022 as hybrid symposium (onsite in Tokyo & online)

COOLChips 25 was successfully held during April 20-22, 2022.


Award Winners @ COOLChips 25

     Best Poster Award

    “A Shared Cache Architecture for VVC Coding” by Yoshiaki Kondo, Masayuki Sato, Ken Nakamura, Yuya Omori, Daisuke Kobayashi, Hiroe Iwasaki, Ryusuke Egawa, Kazuhiko Komatsu and Hiroaki Kobayashi

     Featured Poster Award

    “LLVM Instruction Latency Measurement for Software-Hardware Interface for Multi/many-core” by Hiro Mikami, Kei Torigoe, Makoto Inokawa and Masato Edahiro
    “Posit-Based Vision Transformer (ViT) Exploration at Edge Sites” by Mery Diana, Hiroki Murota, Motoki Amagasaki and Masato Kiyama






Important Dates

  • February 21, 2022  February 11, 2022   Paper / Extended Abstract Submission (Web site)
  • March 18, 2022  Acceptance Notified (by e mail)
  • April 1, 2022  Final Manuscript Submission
  • March 25, 2022  Poster Abstract Submission (Web site)
  • March 28, 2022  Poster Acceptance Notified (by e mail)

For any questions, please contact the Secretariat of COOL Chips 25:
cool_25 “_at_” (Please replace the “at” to @.)