IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 25)
IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 25 is to be held on April 20-22, 2022 as hybrid symposium (onsite in Tokyo & online)
COOLChips 25 was successfully held during April 20-22, 2022.
Award Winners @ COOLChips 25
Best Poster Award
- “A Shared Cache Architecture for VVC Coding” by Yoshiaki Kondo, Masayuki Sato, Ken Nakamura, Yuya Omori, Daisuke Kobayashi, Hiroe Iwasaki, Ryusuke Egawa, Kazuhiko Komatsu and Hiroaki Kobayashi
Featured Poster Award
- “LLVM Instruction Latency Measurement for Software-Hardware Interface
for Multi/many-core” by Hiro Mikami, Kei Torigoe, Makoto Inokawa and
Masato Edahiro
- “Posit-Based Vision Transformer (ViT) Exploration at Edge Sites” by Mery Diana, Hiroki Murota, Motoki Amagasaki and Masato Kiyama
Announcements
Important Dates
- February 21, 2022
February 11, 2022Paper / Extended Abstract Submission (Web site) - March 18, 2022 Acceptance Notified (by e mail)
- April 1, 2022 Final Manuscript Submission
- March 25, 2022 Poster Abstract Submission (Web site)
- March 28, 2022
Poster Acceptance Notified (by e mail)
For any questions, please contact the Secretariat of COOL Chips 25:
cool_25 “_at_” coolchips.org (Please replace the “at” to @.)
