General Information

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 26)


IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 26 is to be held on April 19-21, 2023 in Tokyo.

COOLChips 26 was successfully held during April 19-21, 2023.


Award Winners @ COOLChips 26

     Best Poster Award

    • “Optimized Deep MLP for Tensor Train-based Inference Engine” by Jiale Yan, Masato Motomura



Important Dates

  • February 28 February 10, 2023   Paper / Extended Abstract Submission (Web site)
  • March 17, 2023  Acceptance Notified (by e mail)
  • March 31, 2023  Final Manuscript Submission
  • March 31 March 24, 2023  Poster Abstract Submission (Web site)
  • April 3 March 27, 2023  Poster Acceptance Notified (by e mail)

For any questions, please contact the Secretariat of COOL Chips 26:
cool_26 “_at_” (Please replace the “at” to @.)