COOL Chips XVI
Yokohama Joho Bunka Center (Yokohama Media & Communications Center),
Yokohama, Japan
Call for Contribution
Call for Participation
Advance Program
Registration
Organizing Committee
Program Committee
Advisory Committee
Travel Information
Past COOLCHIPS

COOL16

Sister Conferences HOT CHIPS HOT INTERCONNECTS



Program Committee:

Chairs
M. Ikeda (Univ.of Tokyo)
F. Arakawa (Renesas)
Vice Chair
J. Yao (NAIST)
H. Shimada (NAIST)
Poster Chair
K. Hashimoto (Fukuoka Univ.)
Special Session Chair
H. Tomiyama (Ritsumeikan Univ.)
Members
A. Ben-Abdallah (Aizu Univ.)
K. -R. Cho (Chungbuk National Univ.)
A. Gupta (Freescale)
Y. Han (Chinese Academy of Science)
T. Harada (Yamagata Univ.)
N. Higaki (Panasonic)
Y. Inoguchi (JAIST)
S. Izumi (Kobe Univ.)
K. Kimura (Waseda Univ.)
T. Kobori (NEC)
T. Kodaka (Toshiba)
Y. Kodama (Univ. of Tsukuba)
M. Kuga (Kumamoto Univ.)
G. Lee (Korea Univ.)
S. -J. Lee (Qualcomm)
K. Morioka (Fujitsu Labs.)
M. Muroyama (Tohoku Univ.)
B. -G. Nam (Chungnam National Univ.)
S. Otani (Renesas)
Y. Shibata (Nagasaki Univ.)
K. Shimamura (Hitach)
H. Takizawa (Tohoku Univ.)
N. Togawa (Waseda Univ.)
T. -H. Tsai (NCU Taiwan)
T. Tsutsumi (Meiji Univ.)
Y. Wada (UEC)
H. Yamauchi (Samsung)
K. S. Yeo (NTU Singapore)
(in alphabetical order)
As of October 9, 2012