Call for Contributions

[pdf version is here] (As of October 31, 2017)

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 21 is to be held in Yokohama on April 18-20, 2018, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All papers are published online via IEEE Xplore. Especially, selected academic papers are strongly invited to submit to the special issue on COOL Chips in the IEEE Transactions on Multi-Scale Computing Systems (TMSCS), and selected commercial papers are for publication in IEEE Micro.

Contributions are solicited in the following areas:

  • Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
  • Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
  • Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.

Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare the extended abstract using the given guidelines and template.

Author’s kit:

Submit Format:    pdf, doc

In the extended abstract, the status of the product or topic should precisely be described. If this is a not-yet-announced product, and you would like to keep the submission confidential, please indicate it. We will do our best to maintain confidentiality.

Proposals will be selected by the program committee’s evaluation of interest to the audience. Submission should be made through submission site.

Submission site:

Author Schedule:

  • February 19, 2018    Extended Abstract Submission (through website)
    February 9, 2018    Extended Abstract Submission (through website)
  • March 16, 2018          Acceptance Notified (by e-mail)
  • March 30, 2018          Final Manuscript Submission


Call for Posters

You are invited to submit proposals for a poster session through poster submission site.

Submission site:

The above link is common to the website for the regular paper submission. Please check that the website is for “COOL Chips 21 Poster Session”.

Extended abstract submissions should be ONE page, formatted using standard two-column IEEE format. In addition, one page may be added optionally for figures or tables only. Please be careful not to put the main text of your abstract into the additional second page.

They are refereed primarily based on their relevance to the conference. We also welcome proposals presenting works in progress or reporting preliminary results, in any of the conference themes. Accepted abstracts will be published in the Proceedings of the COOL Chips 21.

All poster presenters will be given the opportunity to present their work in short talks at Main Hall. Therefore, at least one of the authors must be registered at the conference.

Author Schedule (Poster):

  • March 23, 2018    March 27, 2018    Extended Poster Abstract Submission (through website)
  • March 26, 2018    March 30, 2018    Poster Acceptance Notified (by e-mail)


Best Poster Award

Speaker of the best poster of COOL Chips, IEEE Symposium on Low-Power and High-Speed Chips, will be awarded as the “Best Poster Award of COOL Chips.”

Award Committee:
Chaired by COOL Chips Poster Chair
PC Chairs, Vice Chair and Poster Chair
(Makoto Ikeda, Fumio Arakawa, Yasutaka Wada and Koji Hashimoto)

Award Selection:
Award winner is selected among the posters selected as the poster presentations at COOL Chips and presented at the conference site.
Award winner is selected based on voting of the attendees, and the Award Committee will finalize the Award winner.

Award winner is announced at the closing of COOL Chips Symposium. The Best Award winner will receive the award prize of 30,000 JP Yen. Award winner should remain until the Awarding ceremony to receive the Award, otherwise Award will be canceled.


COOLCHips Sponsor Logo

Sponsored by the Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society.  In cooperation with the IEICE Electronics Society and IPSJ.