COOLChips 22 | IEEE Symposium on Low-Power and High-Speed Chips 22

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 22)

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 22 is to be held in Yokohama on April 17-19, 2019.

COOLChips 22 was successfully held during April 17-19, 2019.

Award Winners @ COOLChips 22

Best Poster Award

“An Energy Optimization Method for Hybrid In-Memory Checkpointing” by Muhammad Alfian Amrizal, Mulya Agung, Ryusuke Egawa, Hiroyuki Takizawa

Featured Poster Award

“Design Optimization Methodology for FPGA-Based Accelerator with Multiple Users” by Shuhei Yoshida, Yuta Ukon, Koji Yamazaki, Koyo Nitta

“Partial Reconfiguration Technique for a Multi-board FPGA System FiCSW” by Miho Yamakura, Kazuei Hironaka, Keita Azegami, Kazusa Musha, Hideharu Amano

“Workload-based Dynamic SCM Capacity Management of SCM/NAND Flash Hybrid Storage” by Chihiro Matsui, Ken Takeuchi

See Photo@Closing Remarks

Announcements

Tweets by coolchipsorg

Important Dates

~~February 8, 2019~~ February 22, 2019 Extended Abstract Submission
March 15, 2019 Acceptance Notified
March 29, 2019 Final Manuscript Submission
~~March 22~~March 26, 2019 Poster Abstract Submission
~~March 25~~March 29, 2019 Poster Acceptance Notified

For any questions, please contact the Secretariat of COOL Chips 22:
cool_22 “_at_” coolchips.org (Please replace the “at” to @.)