General Information

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 22)

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 22 is to be held in Yokohama on April 17-19, 2019.

COOLChips 22 was successfully held during April 17-19, 2019.

Award Winners @ COOLChips 22

     Best Poster Award

    “An Energy Optimization Method for Hybrid In-Memory Checkpointing” by Muhammad Alfian Amrizal, Mulya Agung, Ryusuke Egawa, Hiroyuki Takizawa

     Featured Poster Award

    “Design Optimization Methodology for FPGA-Based Accelerator with Multiple Users” by Shuhei Yoshida, Yuta Ukon, Koji Yamazaki, Koyo Nitta
    “Partial Reconfiguration Technique for a Multi-board FPGA System FiCSW” by Miho Yamakura, Kazuei Hironaka, Keita Azegami, Kazusa Musha, Hideharu Amano
    “Workload-based Dynamic SCM Capacity Management of SCM/NAND Flash Hybrid Storage” by Chihiro Matsui, Ken Takeuchi

   See Photo@Closing Remarks



Important Dates

  • February 8, 2019 February 22, 2019 Extended Abstract Submission
  • March 15, 2019 Acceptance Notified
  • March 29, 2019 Final Manuscript Submission
  • March 22March 26, 2019 Poster Abstract Submission
  • March 25March 29, 2019 Poster Acceptance Notified


For any questions, please contact the Secretariat of COOL Chips 22:
cool_22 “_at_” (Please replace the “at” to @.)