COOLChips 22

IEEE Symposium on Low-Power and High-Speed Chips 22

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Poster Award at Closing remarks

Sponsored by Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society.

In cooperation with the IEICE Electronics Society and IPSJ.

COOC Chips 22 is supported by Yokohama Convention & Visitors Bureau.

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