IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XIII
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 14 - 16, 2010
General Information
Call for Contribution
Call for Participation
Advanced Program
Registration
Organizing Committee
Program Committee
Advisory Committee
Travel Information

Sister Conferences HOT CHIPS HOT INTERCONNECTS

CALL FOR CONTRIBUTIONS      [pdf version is here].

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips XIII is to be held in Yokohama on April 14-16, 2010, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. The COOL Chips Organizing Committee will ask the MICRO to publish selected papers in a special issue on COOL Chips XIII.

Contributions are solicited in the following areas:
  • Low Power-High Performance Processors, "Eco-Processors", for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
  • Novel Architectures and Schemes for Single Core, Multi-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.
  • Cool Software including Binary Translations, Compiler Issues and Low Power Techniques.
Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare an extended abstract using the given guidelines and template (Author's kit pdf, doc). The status of the product or topic should precisely be described. If this is a not-yet-announced product, and you would like to keep the submission confidential, please indicate it. We will do our best to maintain confidentiality. Proposals will be selected by the program committee's evaluation of interest to the audience. Submission should be made by e-mail,
to: Makoto Ikeda, Program Chair at submit_xiii"at"coolchips.org. (Please replace the "at" to @.)

Authors Schedule:
January 15, 2010
January 25, 2010
Extended Abstract Submission (by e-mail)
March 1, 2010 Acceptance Notified (by e-mail)
March 15, 2010 Final Manuscript Submission


CALL FOR POSTERS

You are also invited to submit proposals for poster sessions by e-mail, to: M. Muroyama, Poster Chair at poster_xiii"at"coolchips.org. (Please replace the "at" to @.)
Extended abstract submissions should be ONE page, formatted using standard two-column IEEE format. They are refereed primarily based on their relevance to the conference. Accepted abstracts will be published in the Proceedings of the COOL Chips XIII. All participants in this track will have an opportunity to present a poster and a short talk. Submission of a paper to the track signifies an agreement to have one author present the work at the conference.

Authors Schedule (Poster):
March 8, 2010 Poster Abstract Submission (by e-mail)
March 15, 2010 Acceptance Notified (by e-mail)





Sponsored by the Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society. In cooperation with the IEICE Electronics Society, ACM SIGARCHI and IPSJ.