IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XIII
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 14 - 16, 2010
General Information
Call for Contribution
Call for Participation
Advanced Program
Registration
Organizing Committee
Program Committee
Advisory Committee
Travel Information

Sister Conferences HOT CHIPS HOT INTERCONNECTS

 Program Committee:

Chairs
M. Ikeda (Univ.of Tokyo)
F. Arakawa (Renesas Tech.)
Vice Chair
H. Shimada (NAIST)
Poster Chair
M. Muroyama (Tohoku Univ.)
Special Session Co-chairs
H. Tomiyama (Nagoya Univ.)
K. Inoue (Kyusyu Univ.)
Members
B. A. Abderazek (Aizu Univ.)
K. -R. Cho (Chungbuk National Univ.)
T. Harada (Yamagata Univ.)
K. Hashimoto (Fukuoka Univ.)
T. Hashimoto (Panasonic)
H. Igura (NEC)
Y. Inoguchi (JAIST)
H. Kawaguchi (Kobe Univ.)
K. Kimura (Waseda Univ.)
T. Kodaka (Toshiba)
Y. Kodama (AIST)
M. Kondo (UEC)
M. Kuga (Kumamoto Univ.)
G. Lee (Korea Univ.)
H. Nakata (Hitachi)
Y. Shibata (Nagasaki Univ.)
M. H. Sunwoo (Ajou Univ.)
O. Takahashi (IBM)
H. Takizawa (Tohoku Univ.)
N. Togawa (Waseda Univ.)
T. -H. Tsai (NCU Taiwan)
T. Tsutsumi (Meiji Univ.)
U. Walterscheidt (Intel)
H. Yamauchi (Samsung)
K. S. Yeo (NTU Singapore)
H. -J. Yoo (KAIST)
T. Yoshitake (Fujitsu Labs.)
(in alphabetical order)
As of September 15, 2009