Yokohama Joho Bunka Center (Yokohama Media & Communications Center),
CALL FOR CONTRIBUTIONS   [pdf version is here].
COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips XIV is to be held in Yokohama on April 20-22, 2011, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All accepted papers will be published in the Proceedings of the COOL Chips XIV and also included in IEEE Xplore. The COOL Chips Organizing Committee will ask the IEEE MICRO to publish selected papers in a special issue on COOL Chips XIV.
SubmitFormat pdf, doc
In the extended abstract, the status of the product or topic should precisely be described. If this is a not-yet-announced product, and you would like to keep the submission confidential, please indicate it. We will do our best to maintain confidentiality.
Proposals will be selected by the program committee's evaluation of interest to the audience. Submission should be made by e-mail, to: Makoto Ikeda, Program Chair at submit_xiv"at"coolchips.org. (Please replace the "at" to @.)
CALL FOR POSTERSYou are also invited to submit proposals for poster sessions by e-mail, to: M. Muroyama, Poster Chair at poster_xiv"at"coolchips.org. (Please replace the "at" to @.)
Extended abstract submissions should be ONE page, formatted using standard two-column IEEE format. They are refereed primarily based on their relevance to the conference. Accepted abstracts will be published in the Proceedings of the COOL Chips XIV. All participants in this track will have an opportunity to present a poster and a short talk. Submission of a paper to the track signifies an agreement to have one author present the work at the conference.
"Best Poster Award" is newly created. The award will be given for Best Poster voted by participants. However, the poster presenter should attend during the poster session and closing session, or will lose the chance. Please see details of the Best Poster Award.
** News **
Because of a huge earthquake, there's possibility that network and power supply in east Japan become confuse. So, we extended Poster Abstract Submission to 18:00 GMT on March 15. Also, please send Poster Abstract both poster_xiv (at) coolchips.org and shimada (at) is.naist.jp (Hajime Shimada, PC vice chair) to guarantee certain submission.
Best Poster AwardSpeaker of the best poster of COOL Chips, IEEE Symposium on Low-Power and High-Speed Chips, will be awarded as the "Best Poster Award of COOL Chips."
Chaired by COOL Chips Poster Chair
PC Chairs, Vice Chair and Poster Chair
(Makoto Ikeda, Fumio Arakawa, Hajime Shimada and Masanori Muroyama)
Award winner is selected among the posters selected as the poster presentations at COOL Chips and presented at the conference site. Award winner is selected based on voting of the attendees, and the Award Committee will finalize the Award winner (only one person).
Award winner is announced at the closing of COOL Chips Symposium. Award winner will receive the award prize of 30,000 JP Yen. Award winner should remain until the Awarding ceremony to receive the Award, otherwise Award will be canceled.